
- Liu, Yong
Power Electronic Packaging
- Design, Assembly Process, Reliability and Modeling
- Kartoniert,
- Springer, Berlin
- (2014)
267,49 €
inkl. MwSt.
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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segment ...
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DETAILS
- Power Electronic Packaging
- Design, Assembly Process, Reliability and Modeling
- Liu, Yong
- Kartoniert, xviii, 594 S.
- XVIII, 594 p.
- Sprache: Englisch
- 235 mm
- ISBN-13: 978-1-4899-8797-6
- Titelnr.: 48458522
- Gewicht: 926 g
- Springer, Berlin (2014)
Herstelleradresse
Springer Heidelberg
Tiergartenstr. 17|69121|Heidelberg|DE
E-Mail: buchhandel-buch@springer.com
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